the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. document no. pg10091ej03v0ds (3rd edition) date published july 2005 cp(k) printed in japan gaas multi-chip module mc-7832 870 mhz catv 22 db push-pull amplifier data sheet ? nec compound semiconductor devices, ltd. 2001, 2005 description the mc-7832 is a gaas multi-chip module designed for use in catv applications up to 870 mhz. this unit has low distortion, low noise figure and re turn loss across the entire frequency band. reliability and performance uniformity are assured by our stringent quality and control procedures. features ? low distortion high linear gain g l = 22.0 db min. @f = 870 mhz low return loss ordering information part number order number package supplying form mc-7832 mc-7832-az 7-pin special with heatsink (pb-free) 50 pcs max./tray remark to order evaluation samples, contact your nearby sales office. part number for sample order: mc-7832 absolute maximum ratings (t a = +25 c) parameter symbol ratings unit supply voltage v dd 30 v input voltage note v i 65.0 dbmv operating case temperature t c ? 30 to +100 c storage temperature t stg ? 40 to +100 c note in case of single tone caution observe precautions when handling because these devices are sensitive to electrostatic discharge. the mark ? shows major revised points.
data sheet pg10091ej03v0ds 2 mc-7832 recommended operating conditions (z s = z l = 75 ? ) parameter symbol test conditions min. typ. max. unit supply voltage v dd 23.5 24.0 24.5 v input voltage v i 110 channel, flat ? 21.0 27.5 dbmv operating case temperature t c ? 30 + 25 + 85 c electrical characteristics (t c = 30 5 c, v dd = 24 v, z s = z l = 75 ? ) parameter symbol test conditions min. typ. max. unit linear gain g l f = 870 mhz 22.0 ? 23.0 db gain slope g slope f = 40 to 870 mhz 0.6 ? 1.4 db gain flatness g flatness f = 40 to 870 mhz, peak to valley ? ? 0.7 db noise figure 1 nf 1 f = 50 mhz ? ? 6.0 db noise figure 2 nf 2 f = 870 mhz ? ? 6.5 db operating current i dd p in = none 180 ? 240 ma composite triple beat ctb ? ? ? 57 dbc cross modulation xm ? ? ? 50 dbc composite 2nd order beat cso 110 channel, v o = 44 dbmv, flat ? ? ? 57 dbc input / output return loss 1 rl 1 f = 40 to 160 mhz 20 ? ? db input / output return loss 2 rl 2 f = 160 to 320 mhz 19 ? ? db input / output return loss 3 rl 3 f = 320 to 640 mhz 17.5 ? ? db input / output return loss 4 rl 4 f = 640 to 870 mhz 16 ? ? db
data sheet pg10091ej03v0ds 3 mc-7832 package dimensions 7-pin special with heatsink (unit: mm) 27.5 max. 38.10.25 45.08 max. 4.00.25 8.1 max. 3.2 max. 14.85 max. 0.510.05 12.9 max. 21.5 max. 4.190.13 6-32unc2b 123 789 5 19.050.38 2.540.38 0.510.05 2.620.35 10.750.25 4.25 +0.25 ?0.35 0.05 0.38.. a 2.5 6.3 2.540.25 25.40.25 a pin connection 1 2378 in 9 out gnd v dd 5
data sheet pg10091ej03v0ds 4 mc-7832 notes on correct use (1) the space between pc board and root of the lead should be kept more than 1 mm to prevent undesired stress to the lead and also should be kept less than 4 mm to prevent undesired par asitic inductance. recommended that space is 2.0 to 3.0 mm typical. (2) recommended torque strength of the screw is 59 to 78 ncm. (3) form the ground pattern as wide as possible to minimize ground impedance. (to prevent undesired oscillation) all the ground pins must be connec ted together with wide ground pattern to decrease impedance difference. recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recomm ended below, contact your nearby sales office. soldering method soldering condi tions recommended condition symbol partial heating peak temperature (pin temperature) : 350 c or below note soldering time (per pin of device) : 3 seconds or less ? note the point of pin part heating mu st be kept more than 1.2 mm di stance from the root of lead.
data sheet pg10091ej03v0ds 5 mc-7832 when the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the au thority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license . m8e 00. 4 - 0110 the information in this document is current as of july, 2005. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product be fore using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ?
mc-7832 caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. follow related laws and ordinanc es when disposing of the produc t. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (wit h a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industria l waste and household garbage, and ensure that the product is controlled (as industria l waste subject to special c ontrol) up until final disposal. do not burn, destroy, cut, crush, or chemically di ssolve the product. do not lick the product or in any way allow it to enter the mouth. nec compound semiconductor devices hong kong limited e-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-558-5209 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-0 fax: +49-211-6503-1327 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0504 nec compound semiconductor devices, ltd. http://www.ncsd.necel.com/ e-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) sales division tel: +81-44-435-1573 fax: +81-44-435-1579 for further information, please contact
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